Feature

1. Adopt dark infrared heating principle, closed loop temperature control, accurate and stable temperature, small fluctuation. The bottom is heated by a dark infrared ceramic plate, and the top is heated by a high infrared heating tube, which has a long life. Minimize the lateral temperature difference of BGA and prevent BGA from being damaged by cold welding or overheating.

2. Designed with an observation window, you can observe the melting of the BGA chip solder ball in real time, and can weld different specifications of BGA at the same time.

3. There is an audible and visual alarm when the heating box is opened during the welding process.

4. When the box is opened after the process is over, the cooling fan automatically works; when the box is closed, the cooling fan also stops working at the same time.

5. The panel is equipped with two external K-type sensors, which can monitor the actual temperature of the BGA, so that the welding can be targeted.

  Device parameters