1. The heating is fast, it only takes 10 seconds to reach 250°C.
2. Built-in temperature sensor, stable output temperature.
3. Hot and cold air selection, can preheat and cool the chip.
4. Use with desoldering station to process BGA and other chip ICs.
|
|
|
QUICK 800S bracket assembly | QUICK 800LBracket assembly | QUICK 800ABracket assembly |
model | QUICK 853 |
power | 460W |
temperature range | 120℃ ～ 250℃ |
Air volume | 0.18 m3/min |
Dimensions | 100*170*60mm |
Outlet diameter | 40mm |
weight | about 1.0kg |
